| Item | Current | 2013 | 2014 | |
| Max. Layer | 30 | 30 | 30 | |
| Track width/space | inner（mil） | 3 / 3 | 3 / 3 | 3/ 3 |
| outer（mil） | 3 / 3 | 4 / 3 | 3 / 3 | |
| Aspect Ratio | 15 : 1 | 14 : 1 | 15 : 1 | |
| Copper Weight (oz) | 12 | 8 | 10 | |
| Impedance tolerance | ±5% | ±8% | ±5% | |
| Material | Microwave material | MP | SV | SV |
| Via in pad | MP | SV | SV | |
| Lead-free | MP | MP | MP | |
| Mix lamination | MP | P | SV | |
| Metal Based/Core | MP | SV | SV | |
| HiTg | MP | MP | MP | |
| HDI | 1+N+1 | MP | P | P |
| Buried resistance/electric capacity | MP | / | P | |
| P: Prototype SV: Small Volume MP: Mass Production | ||||
