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Flexible Printed Circuit (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film. It has the characteristics of high wiring density, light weight, thin thickness and good bendability.

1: Because it is thin, it can be bent freely, and the assembly space can be effectively used.
2: It has excellent repeated buckling, which can save the wiring space of the working part.
3; Has a good followability to the uneven parts

FPC will continue to innovate from four aspects in the future, mainly in:
1. Thickness. The thickness of FPC must be more flexible and must be thinner;
2. Folding resistance. The ability to bend is an inherent feature of FPC. In the future, FPC must be more resistant to bending, which must exceed 10,000 times. Of course, this requires a better substrate;
3. Price. At this stage, the price of FPC is much higher than that of PCB. If the price of FPC comes down, the market will be much broader.
4. Process level. In order to meet various requirements, the FPC process must be upgraded, and the minimum aperture and minimum line width/line spacing must meet higher requirements.