FPC flexible circuit board is a kind of highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability.
In the production process, in order to prevent excessive opening and short circuits from causing too low yield or reducing rough process problems such as drilling, rolling, cutting, etc., the FPC board is scrapped and refilled, and how to select materials to achieve customer use The best effect flexible circuit board. Prenatal pretreatment is especially important.
Pre-natal pretreatment, there are three aspects that need to be dealt with, and all three aspects are completed by engineers. The first is the FPC board engineering evaluation, which mainly evaluates whether the customer’s FPC board can be produced, whether the company’s production capacity can meet the customer’s board-making requirements and unit cost; if the engineering evaluation is passed, the next step is to prepare materials immediately to meet each production link Finally, the engineer processes the customer’s CAD structure drawing, gerber line data and other engineering documents to suit the production environment and production specifications of the production equipment, and then delegates the production drawings and MI (engineering process card) to the The production department, document control, purchasing and other departments enter the regular production process.
Double panel system
Cutting → Drilling → PTH → Plating → Pre-treatment → Pasting Dry Film → Alignment → Exposure → Development → Graphic Plating → Stripping → Pretreatment → Pasting Dry Film → Positioning Exposure → Development → Etching → Stripping → Surface Treatment → Paste the cover film → Pressing → Curing → Immersion of nickel gold → Printing characters → Shearing → Electrical test → Punching → Final inspection → Packaging → Shipment
Single panel system
Cutting → Drilling → Pasting Dry Film → Aligning → Exposure → Developing → Etching → Stripping → Surface Treatment → Covering Film → Pressing → Curing → Surface Treatment → Immersion Nickel Gold → Printing Characters → Cutting → Electrical Measurement → Punching Cutting → final inspection → packaging → shipment
1: Because it is thin, it can be bent freely, and the assembly space can be effectively used.
2: It has excellent repeated buckling, which can save the wiring space of the working part.
3; Has a good followability to the uneven parts
1 layer flex board
Substrate：PI polyimide film 25μm (1mil), 12.5μm (1/2mil)
Copper foil ：12μm (1/3oz), 35μm (1oz), 17.5μm (1/2oz)
Cover material：PI polyimide film 25μm (1mil), 12.5μm (1/2mil)
Photosensitive cover coating/photosensitive cover film/and special materials
Surface treatment： tin, gold plating, immersion gold, OSP anti-oxidation, immersion silver