1 layer flex board

Substrate:PI polyimide film 25μm (1mil), 12.5μm (1/2mil)
Copper foil :12μm (1/3oz), 35μm (1oz), 17.5μm (1/2oz)
Cover material:PI polyimide film 25μm (1mil), 12.5μm (1/2mil)
Photosensitive cover coating/photosensitive cover film/and special materials
Surface treatment: tin, gold plating,  immersion gold, OSP anti-oxidation, immersion silver

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